Invention Grant
- Patent Title: Molding machine management system
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Application No.: US17527318Application Date: 2021-11-16
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Publication No.: US11712827B2Publication Date: 2023-08-01
- Inventor: Yusuke Mitsuma , Yoshiaki Otsuki , Ko Tsukada
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP 20190968 2020.11.17
- Main IPC: B29C45/17
- IPC: B29C45/17 ; B29C45/76 ; G05B19/4155

Abstract:
Provided is a molding machine management system that manages production of a plurality of molding machines, including: a display unit configured to display a production performance and a planned production status in association with a time axis for each molding machine, and, when the molding machine management system receives an abnormality of a molding machine, to display the abnormality of the molding machine in association with the time axis for each molding machine. The molding machine management system configured as described above can appropriately manage each molding machine.
Public/Granted literature
- US20220152894A1 MOLDING MACHINE MANAGEMENT SYSTEM Public/Granted day:2022-05-19
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