Invention Grant
- Patent Title: Mold die, method of manufacturing mold die, injection molding apparatus, and method of manufacturing mold product
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Application No.: US16772467Application Date: 2019-10-31
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Publication No.: US11712828B2Publication Date: 2023-08-01
- Inventor: Tatsumi Onishi , Yusuke Mitsui
- Applicant: KASAI KOGYO CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: KASAI KOGYO CG., LTD.
- Current Assignee: KASAI KOGYO CG., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: United IP Counselors, LLC
- Priority: JP 19028196 2019.02.20
- International Application: PCT/JP2019/042838 2019.10.31
- International Announcement: WO2020/170506A 2020.08.27
- Date entered country: 2020-06-12
- Main IPC: B29C45/26
- IPC: B29C45/26 ; B29C33/38 ; B29C33/42 ; C23C18/32 ; C23C18/18 ; B29L31/30

Abstract:
A mold cavity which is a mold die includes a die body and a plating layer provided on the surface of a mold surface. In this case, the mold surface has a leather-grain transfer surface for forming a grain pattern. The leather-grain transfer surface includes a first uneven-shape part and a second uneven-shape part formed at the surface of the first uneven-shape part and smaller in an uneven-shape width than the first uneven-shape part. The uneven-shape width falls within a range of 10 μm or more and less than 500 μm. The plating layer is an electroless-plating layer. A thickness of at least part of the plating layer falls within a range of 0.1 μm or more and less than 10 μm.
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