Invention Grant
- Patent Title: Process for bonding flexible films and device for carrying out the same
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Application No.: US17453062Application Date: 2021-11-01
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Publication No.: US11712880B2Publication Date: 2023-08-01
- Inventor: Hans-Georg Kinzelmann
- Applicant: Henkel AG & Co. KGaA
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent James E. Piotrowski
- Priority: EP 172264 2019.05.02
- Main IPC: B32B37/06
- IPC: B32B37/06 ; B32B37/00 ; B32B37/10 ; B32B37/12
Abstract:
The present invention refers to a process for bonding flexible films by converting the surface of a first film into a softened state before contacting the softened surface with a second film, a device for carrying out the inventive process as well as a composite body obtained by the inventive process or by the inventive device.
Public/Granted literature
- US20220105718A1 Process for Bonding Flexible Films and Device for Carrying out the Same Public/Granted day:2022-04-07
Information query
