Invention Grant
- Patent Title: Separation device assemblies
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Application No.: US16203817Application Date: 2018-11-29
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Publication No.: US11713142B2Publication Date: 2023-08-01
- Inventor: William Fairlie , Erik Saucier
- Applicant: Ensign-Bickford Aerospace & Defense Company
- Applicant Address: US CT Simsbury
- Assignee: Ensign-Bickford Aerospace & Defense Comany
- Current Assignee: Ensign-Bickford Aerospace & Defense Comany
- Current Assignee Address: US CT Simsbury
- Agency: McCarter & English, LLP
- Agent Dave S. Christensen
- Main IPC: B64G1/64
- IPC: B64G1/64 ; F42B15/38

Abstract:
Separation device assemblies are provided. The assemblies include a plurality of first segment elements, each first segment element having an attachment portion and a frangible portion, the attachment portion of the first segment elements is arranged to fixedly connect to a first structural component and at least one second segment element having an attachment portion and a securing portion, wherein the attachment portion of the at least one second segment element is arranged to fixedly connect to a second structural component. At least two of the plurality of first segment elements are attached to the at least one second segment element adjacent to each other and a first segment joint is formed between adjacent first segment elements. An expansion device cavity is formed between the attached first and second segment elements.
Public/Granted literature
- US20190168898A1 SEPARATION DEVICE ASSEMBLIES Public/Granted day:2019-06-06
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