Invention Grant
- Patent Title: Dip molding composition, method of producing glove, and glove
-
Application No.: US16477247Application Date: 2019-03-27
-
Publication No.: US11713401B2Publication Date: 2023-08-01
- Inventor: Norihide Enomoto , Taichi Ogawa , Kaname Shibata , Junji Shibasaki
- Applicant: Midori Anzen Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Midori Anzen Co., Ltd.
- Current Assignee: Midori Anzen Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Marshall, Gerstein & Borun LLP
- Priority: JP 18074240 2018.04.06 JP 18074929 2018.04.09
- International Application: PCT/JP2019/013455 2019.03.27
- International Announcement: WO2019/194056A 2019.10.10
- Date entered country: 2019-07-11
- Main IPC: C09D109/02
- IPC: C09D109/02 ; A41D19/00 ; A61B42/10 ; B29C41/14 ; C08J3/24 ; C08J3/26 ; C08J5/02 ; C08J5/18 ; C09D109/04 ; B29K33/18 ; B29K105/24 ; B29L31/48

Abstract:
Provided is a dip molding composition including, at least: an elastomer that contains a (meth)acrylonitrile-derived structural unit, an unsaturated carboxylic acid-derived structural unit, and a butadiene-derived structural unit in a polymer main chain; an epoxy crosslinking agent; water; and a pH modifier, in which dip molding composition the elastomer contains the (meth)acrylonitrile-derived structural unit in an amount of 20 to 40% by weight, the unsaturated carboxylic acid-derived structural unit in an amount of 1 to 10% by weight, and the butadiene-derived structural unit in an amount of 50 to 75% by weight, and the epoxy crosslinking agent includes an epoxy crosslinking agent containing an epoxy compound having three or more epoxy groups in one molecule and has a dissolution rate in water of 10 to 70% as determined by a specific measurement method.
Public/Granted literature
- US20210221966A1 DIP MOLDING COMPOSITION, METHOD OF PRODUCING GLOVE, AND GLOVE Public/Granted day:2021-07-22
Information query
IPC分类: