Invention Grant
- Patent Title: Polishing agent, polishing method, and liquid additive for polishing
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Application No.: US17318421Application Date: 2021-05-12
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Publication No.: US11713404B2Publication Date: 2023-08-01
- Inventor: Toshihiko Otsuki
- Applicant: AGC INC.
- Applicant Address: JP Chiyoda-ku
- Assignee: AGC INC.
- Current Assignee: AGC INC.
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 17215520 2017.11.08
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/321 ; C09G1/00 ; C09G1/06 ; C09K3/14 ; C09G1/04 ; C09K13/06 ; B24B37/04 ; B24B1/00 ; H01L21/306 ; H01L21/3105 ; H01L21/304 ; H01L21/762
Abstract:
The present invention relates to a polishing agent including: a water-soluble polymer including a copolymer of a monomer (A) which includes at least one member selected from the group consisting of an unsaturated dicarboxylic acid, a derivative thereof, and salts of the unsaturated dicarboxylic acid and the derivative thereof and a monomer (B) other than the monomer (A), comprising an ethylenic double bond and no acidic group; a cerium oxide particle; and water, in which the polishing agent has a pH of 4 to 9.
Public/Granted literature
- US20210261824A1 POLISHING AGENT, POLISHING METHOD, AND LIQUID ADDITIVE FOR POLISHING Public/Granted day:2021-08-26
Information query
