Invention Grant
- Patent Title: Heat dissipation device
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Application No.: US17983264Application Date: 2022-11-08
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Publication No.: US11713927B2Publication Date: 2023-08-01
- Inventor: Kui-Yen Chen , Shan-Yin Cheng
- Applicant: COOLER MASTER CO., LTD.
- Applicant Address: TW Taipei
- Assignee: COOLER MASTER CO., LTD.
- Current Assignee: COOLER MASTER CO., LTD.
- Current Assignee Address: TW Taipei
- Agency: Maschoff Brennan
- Priority: TW 9146305 2020.12.25
- The original application number of the division: US17220646 2021.04.01
- Main IPC: F28D15/02
- IPC: F28D15/02 ; F28D1/03 ; F28D21/00

Abstract:
A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base and at least one heat dissipation fin. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet.
Public/Granted literature
- US20230055907A1 HEAT DISSIPATION DEVICE Public/Granted day:2023-02-23
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