Presented embodiments facilitate efficient and effective diagnostic of test system operations, including temperature control of test equipment components. In one embodiment a test equipment diagnostic method includes applying a known/expected first bit pattern to a test equipment component, applying a known/expected second bit pattern to a test equipment component, and performing a test equipment temperature control analysis based upon the results of applying the known/expected first bit pattern and known/expected second bit pattern. The first bit pattern and second bit pattern have known/expected respective thermal loads and corresponding respective first known/expected/expected temperature and second known/expected/expected temperature. In one embodiment, performing a test equipment temperature control analysis includes determining if temperature control components control a temperature of the test equipment component within acceptable tolerances. In one exemplary implementation, the test equipment component is a test control component (e.g., a field programmable gate array (FPGA), etc.).