Invention Grant
- Patent Title: Sensor-cluster apparatus
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Application No.: US17713244Application Date: 2022-04-05
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Publication No.: US11714185B2Publication Date: 2023-08-01
- Inventor: Jun Su Chun , Hee Chang Roh
- Applicant: HYUNDAI MOBIS Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: Hyundai Mobis Co., Ltd.
- Current Assignee: Hyundai Mobis Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: H.C. Park & Associates, PLC
- Priority: KR 20190134012 2019.10.25
- Main IPC: G01S13/86
- IPC: G01S13/86 ; G01S13/931 ; G01S7/02

Abstract:
A sensor-cluster apparatus, in which a sensor configured to detect and collect external environment information is mounted in a case. The sensor-cluster apparatus includes a body member on which one kind or more of sensors are mounted on one surface thereof, a case in which an inner space is provided, and one surface thereof is opened to define an opening and on which the body member is mounted so that each of the sensors is exposed to the opening, and a position control device mounted inside the case to adjust a mounting position or a mounting angle of the body member.
Public/Granted literature
- US20220229170A1 SENSOR-CLUSTER APPARATUS Public/Granted day:2022-07-21
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