Invention Grant
- Patent Title: Temperature interpolation techniques for multiple integrated circuit references
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Application No.: US17666124Application Date: 2022-02-07
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Publication No.: US11714443B2Publication Date: 2023-08-01
- Inventor: Anupriya Chakraborty , John David Porter , Alan John Wilson
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G05F3/20
- IPC: G05F3/20 ; G11C5/14

Abstract:
Techniques for providing temperature trim codes to multiple reference circuits of an integrated circuit are provided. In an example, a string of primary latch circuits can provide a set of pre-defined temperature trim codes to a multiplexer in response to a token of a series of tokens. The multiplexer can provide two trim of the trim codes to an interpolator based on a temperature reading of the integrated circuit. The interpolator can provide an interpolated trim code and the trim code can be distributed to a reference circuit based on the token.
Public/Granted literature
- US20220261027A1 TEMPERATURE INTERPOLATION TECHNIQUES FOR MULTIPLE INTEGRATED CIRCUIT REFERENCES Public/Granted day:2022-08-18
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