Invention Grant
- Patent Title: Electronic device having thermal diffusion structure
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Application No.: US17532518Application Date: 2021-11-22
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Publication No.: US11714468B2Publication Date: 2023-08-01
- Inventor: Ohhyuck Kwon , Jaeyoung Huh , Daesuk Kang , Seunghoon Kang , Boram Kim , Hongki Moon , Yoonsun Park , Kyungwoo Lee , Seungjoo Lee , Jonghoon Lim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Priority: KR 20190010505 2019.01.28
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H01L23/427 ; G06F1/16

Abstract:
Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.
Public/Granted literature
- US20220083110A1 ELECTRONIC DEVICE HAVING THERMAL DIFFUSION STRUCTURE Public/Granted day:2022-03-17
Information query