Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US16902762Application Date: 2020-06-16
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Publication No.: US11715602B2Publication Date: 2023-08-01
- Inventor: Min Jung Cho , Byung Kun Kim , Su Ji Kang , Yu Hong Oh
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190094258 2019.08.02 KR 20190128544 2019.10.16
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G2/06 ; H01G4/12 ; H01G4/008

Abstract:
A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately stacked therein in a stacking direction; and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes 94.0 to 99.6 wt % of Ni and 0.4 to 6.0 wt % of Cu.
Public/Granted literature
- US20210035741A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2021-02-04
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