Invention Grant
- Patent Title: Method of forming plasma processing apparatus, related apparatus, and method of forming semiconductor device using the same
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Application No.: US17184962Application Date: 2021-02-25
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Publication No.: US11715628B2Publication Date: 2023-08-01
- Inventor: Jeongil Mun , Kyeonghun Kim , Taekyoon Park , Jongwoo Sun , Seeyub Yang , Yongseok Lee , Hyungjoo Lee , Eunhee Jeang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR 20200099852 2020.08.10
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01J9/24

Abstract:
A method of forming a plasma processing apparatus comprises providing a chamber, the chamber including a wall defining an interior, and a viewport extending through the wall. An analysis apparatus connected to the viewport may be formed. The analysis apparatus includes an analyzer adjacent to the chamber, a probe connected to the analyzer and aligned with the viewport, and a first window aligned with the probe, the first window having a first surface, and a second surface at an opposite side relative to the first surface, the second surface being exposed to the interior of the chamber, and the second surface of the first window has a scattering surface.
Public/Granted literature
- US3243492A Stabilized panel production Public/Granted day:1966-03-29
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