Invention Grant
- Patent Title: Position measuring apparatus and measuring method
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Application No.: US17304118Application Date: 2021-06-15
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Publication No.: US11715660B2Publication Date: 2023-08-01
- Inventor: Manabu Takakuwa
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 20154266 2020.09.15
- Main IPC: H01L21/68
- IPC: H01L21/68 ; G01B11/00 ; H01L21/67

Abstract:
According to one embodiment, a position measuring apparatus includes a substrate holding part, a projection part, a liquid supply part, an imaging part, a position measuring part, and a control unit. The substrate holding part is configured to hold a substrate including at least part of a circuit pattern. The projection part is configured to irradiate the substrate held on the substrate holding part with illumination light, and to transmit reflected light from the substrate, of the illumination light radiated on the substrate. The liquid supply part is configured to supply a liquid into a space between the substrate held on the substrate holding part and the projection part. The imaging part is configured to receive the reflected light transmitted through the projection part, and to generate an image signal based on the reflected light. The position measuring part is configured to obtain positional information on a position of the substrate holding part. The control unit is configured to determine a coordinate position of the at least part of a circuit pattern in the substrate, on a basis of the positional information and the image signal.
Public/Granted literature
- US20220084864A1 POSITION MEASURING APPARATUS AND MEASURING METHOD Public/Granted day:2022-03-17
Information query
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