Invention Grant
- Patent Title: Height adjustable semiconductor wafer support
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Application No.: US16787106Application Date: 2020-02-11
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Publication No.: US11715665B2Publication Date: 2023-08-01
- Inventor: Ming Shing , Yichi Yen , Chun Liang Chen , Kuo Lun Lo
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L21/687
- IPC: H01L21/687
Abstract:
A height adjustable semiconductor wafer support is provided. The height adjustable semiconductor wafer support includes a chuck for supporting a semiconductor wafer, an adjustment mechanism having a top surface for supporting the chuck, and a stage coupled to the adjustment mechanism such that movement of the top surface of the adjustment mechanism relative to the stage changes a distance between the top surface of the adjustment mechanism and a top surface of the stage.
Public/Granted literature
- US20210249298A1 HEIGHT ADJUSTABLE SEMICONDUCTOR WAFER SUPPORT Public/Granted day:2021-08-12
Information query
IPC分类:
