- Patent Title: Variable dielectric constant materials in same layer of a package
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Application No.: US16883829Application Date: 2020-05-26
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Publication No.: US11715688B2Publication Date: 2023-08-01
- Inventor: Aniket Patil , Hong Bok We
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Seyfarth Shaw LLP
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/528 ; H01L25/065 ; H01L23/00 ; H01L23/522 ; H01L23/532 ; H01L21/762 ; H01L29/06
Abstract:
A package substrate has a dielectric layer and a redistribution metal layer. The dielectric layer has a first dielectric material and a second dielectric material. The first dielectric material is different than the second dielectric material. The second dielectric material may have a dielectric constant that is either greater than or less than the dielectric constant of the first dielectric material. The second dielectric may be selected based on a specific target application such as single-ended signal routing or serializer/deserializer (SERDES) routing.
Public/Granted literature
- US20210375743A1 VARIABLE DIELECTRIC CONSTANT MATERIALS IN SAME LAYER OF A PACKAGE Public/Granted day:2021-12-02
Information query
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