Invention Grant
- Patent Title: Semiconductor chip, semiconductor device and electrostatic discharge protection method for semiconductor device thereof
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Application No.: US17382751Application Date: 2021-07-22
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Publication No.: US11715706B2Publication Date: 2023-08-01
- Inventor: Chun-Lu Lee
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L23/60
- IPC: H01L23/60 ; H01L23/525 ; H01L25/00 ; H01L25/065 ; H01L27/02

Abstract:
The present application discloses a semiconductor chip, a semiconductor device and an electrostatic discharge (ESD) protection method for a semiconductor device. The semiconductor chip includes an electrical contact, an application circuit, and an ESD protection unit. The application circuit performs operations according to a one signal received by the electrical contact. The ESD protection unit is coupled to the electrical contact. The capacitance of the ESD protection unit is adjustable.
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Information query
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