Invention Grant
- Patent Title: Semiconductor device and manufacturing method
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Application No.: US17078042Application Date: 2020-10-22
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Publication No.: US11715771B2Publication Date: 2023-08-01
- Inventor: Yoshiharu Kato , Toru Ajiki , Tohru Shirakawa , Misaki Takahashi , Kaname Mitsuzuka , Takashi Yoshimura , Yuichi Onozawa , Hiroshi Takishita , Soichi Yoshida
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP 18215549 2018.11.16 JP 19203105 2019.11.08
- Main IPC: H01L29/36
- IPC: H01L29/36 ; H01L21/265 ; H01L29/06 ; H01L29/10

Abstract:
Provided is a semiconductor device comprising a semiconductor substrate, wherein the semiconductor substrate includes a hydrogen containing region including hydrogen, and the hydrogen containing region includes a high concentration region with a higher carrier concentration than a virtual carrier concentration determined based on a concentration of hydrogen included and an activation ratio of hydrogen. The semiconductor substrate includes an N type drift region, an N type emitter region that has a higher carrier concentration than that in the drift region, a P type base region, a P type collector region provided to be in contact with a lower surface of the semiconductor substrate, and an N type buffer region that is provided between the collector region and the drift region, and has a higher carrier concentration than that in the drift region, and the hydrogen containing region is included in the buffer region.
Public/Granted literature
- US20210043739A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD Public/Granted day:2021-02-11
Information query
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