Invention Grant
- Patent Title: Semiconductor device and method
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Application No.: US16887219Application Date: 2020-05-29
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Publication No.: US11715777B2Publication Date: 2023-08-01
- Inventor: Guan-Ren Wang , Yun-Min Chang , Yu-Lien Huang , Ching-Feng Fu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L29/78 ; H01L27/088 ; H01L29/423

Abstract:
A semiconductor device including source/drain contacts extending into source/drain regions, below topmost surfaces of the source/drain regions, and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a semiconductor substrate; a first channel region over the semiconductor substrate; a first gate stack over the semiconductor substrate and surrounding four sides of the first channel region; a first epitaxial source/drain region adjacent the first gate stack and the first channel region; and a first source/drain contact coupled to the first epitaxial source/drain region, a bottommost surface of the first source/drain contact extending below a topmost surface of the first channel region.
Public/Granted literature
- US20210376101A1 SEMICONDUCTOR DEVICE AND METHOD Public/Granted day:2021-12-02
Information query
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