Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US17687817Application Date: 2022-03-07
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Publication No.: US11715801B2Publication Date: 2023-08-01
- Inventor: Junichiro Sakata , Takuya Hirohashi , Hideyuki Kishida
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP 09053399 2009.03.06
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/417 ; H01L29/423 ; H01L29/49 ; H01L21/02 ; H01L29/66 ; H01L27/12 ; H01L29/08 ; H01L29/10 ; H01L29/24

Abstract:
It is an object to provide a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a semiconductor device including an inverted staggered thin film transistor whose semiconductor layer is an oxide semiconductor layer, a buffer layer is provided over the oxide semiconductor layer. The buffer layer is in contact with a channel formation region of the semiconductor layer and source and drain electrode layers. A film of the buffer layer has resistance distribution. A region provided over the channel formation region of the semiconductor layer has lower electrical conductivity than the channel formation region of the semiconductor layer, and a region in contact with the source and drain electrode layers has higher electrical conductivity than the channel formation region of the semiconductor layer.
Public/Granted literature
- US20220190166A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-06-16
Information query
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