Invention Grant
- Patent Title: Light-emitting element package and light-emitting element module including same
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Application No.: US17052182Application Date: 2019-03-04
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Publication No.: US11715817B2Publication Date: 2023-08-01
- Inventor: Koh Eun Lee
- Applicant: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- Applicant Address: CN Taicang
- Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- Current Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- Current Assignee Address: CN Suzhou
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR 20180051257 2018.05.03
- International Application: PCT/KR2019/002474 2019.03.04
- International Announcement: WO2019/212136A 2019.11.07
- Date entered country: 2020-10-31
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/62 ; H01L33/64 ; A61L2/10 ; A61L2/26 ; A61L9/20

Abstract:
Disclosed in an embodiment is a light-emitting element package comprising: a body including a cavity; a light-emitting element arranged on the bottom surface of the cavity and including a first conductive type semiconductor layer, a second conductive type semiconductor layer and an active layer, which is arranged between the first conductive type semiconductor layer and the second conductive type semiconductor layer; and a light-transmitting member arranged on the upper part of the cavity, wherein the body includes: a lower body including the bottom surface of the cavity; an upper body including the lateral surface of the cavity; and a first insulating layer arranged between the lower body and the upper body, the lower body includes a first conductive body and a second conductive body insulated and arranged together with the first conductive body, the first conductive type semiconductor layer is electrically connected with the first conductive body, the second conductive type semiconductor layer is electrically connected with the second conductive body, and the height from the lower surface of the lower body to the bottom surface of the cavity is less than the height from the lower surface of the lower body to the lower surface of the first insulating layer.
Public/Granted literature
- US20210305465A1 LIGHT-EMITTING ELEMENT PACKAGE AND LIGHT-EMITTING ELEMENT MODULE INCLUDING SAME Public/Granted day:2021-09-30
Information query
IPC分类: