Invention Grant
- Patent Title: Three-dimensional electronic component and electronic device
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Application No.: US17476544Application Date: 2021-09-16
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Publication No.: US11715878B2Publication Date: 2023-08-01
- Inventor: Zhi-Hua Feng , Chia-Ho Lin , Pin-Tang Chiu , Zhen-De Jiang
- Applicant: ASUSTeK COMPUTER INC.
- Applicant Address: TW Taipei
- Assignee: ASUSTEK COMPUTER INC.
- Current Assignee: ASUSTEK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW 9134311 2020.09.30
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/48 ; H01Q5/357

Abstract:
A three-dimensional electronic component includes a first surface, a second surface, a third surface, and a fourth surface, and an antenna structure. The antenna structure includes a first radiating metal portion, a second radiating metal portion, an adjusting metal branch, a first ground connection portion, a second ground connection portion, a feed point, and a ground point. The first radiating metal portion on the first surface extends to the second surface. The second radiating metal portion on the first surface extends to the third surface. A gap is between the first radiating metal portion and the second radiating metal portion. The adjusting metal branch on the first surface is connected to the first radiating metal portion. The feed point on the first radiating metal portion is close to the gap. The ground point on the second radiating metal portion is close to the gap.
Public/Granted literature
- US20220102862A1 THREE-DIMENSIONAL ELECTRONIC COMPONENT AND ELECTRONIC DEVICE Public/Granted day:2022-03-31
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