Invention Grant
- Patent Title: High frequency electrical connector assembly
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Application No.: US16930537Application Date: 2020-07-16
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Publication No.: US11715892B2Publication Date: 2023-08-01
- Inventor: Owen R. Barthelmes , Michael A. Hoyack
- Applicant: Amphenol Corporation
- Applicant Address: US CT Wallingford
- Assignee: AMPHENOL CORPORATION
- Current Assignee: AMPHENOL CORPORATION
- Current Assignee Address: US CT Wallingford
- Agency: Cantor Colburn LLP
- Main IPC: H01R9/05
- IPC: H01R9/05 ; H01R24/50 ; H01R13/6582 ; H01R13/6583 ; H01R24/54 ; H01R103/00 ; H01R13/6599

Abstract:
A connector assembly that includes a receptacle with inner and outer shells which have a front end for mating with a mating connector and a back end configured to connect to a printed circuit board. Receptacle primary and secondary ground connections are located on one of the shells. A plug with an outer shell that supports a pin contact to mate with the socket contact. The outer shell of the plug has a front end for mating with the front end of the receptacle and a back end that is configured to connect to a coaxial cable. Plug primary and secondary ground connections are located on the outer shell. When the receptacle and plug are mated, the primary ground connections form a primary grounding path through the assembly and the secondary ground connections form a secondary grounding path through the assembly, thereby electrically connecting the plug with the board.
Public/Granted literature
- US20200350712A1 HIGH FREQUENCY ELECTRICAL CONNECTOR ASSEMBLY Public/Granted day:2020-11-05
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