Invention Grant
- Patent Title: Board connector
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Application No.: US17400541Application Date: 2021-08-12
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Publication No.: US11715901B2Publication Date: 2023-08-01
- Inventor: Hidekazu Matsuda
- Applicant: SUMITOMO WIRING SYSTEMS, LTD.
- Applicant Address: JP Mie
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee Address: JP Mie
- Agency: Venjuris, P.C.
- Priority: JP 20143816 2020.08.27
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H01R13/422 ; H01R12/57

Abstract:
A board connector A includes a housing 10 to be mounted on a circuit board P, and first and second terminal fittings 21, 31 mounted in the housing. The first and second terminal fittings 21, 31 include first and second board connecting portions 22, 32 projecting from a facing surface 15 of the housing 10 facing the circuit board P and to be surface-mounted on the circuit board P. The first and second board connecting portions 22, 32 extend in a direction intersecting a facing direction of the circuit board P and the facing surface 15. A jig accommodating portion 16 recessed from a region of the facing surface 15 not facing the first and second board connecting portions 22, 32 is formed in a region of the facing surface 15 facing the first and second board connecting portions 22, 32.
Public/Granted literature
- US20220069504A1 BOARD CONNECTOR Public/Granted day:2022-03-03
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