Invention Grant
- Patent Title: Low insertion force contact terminal
-
Application No.: US17382842Application Date: 2021-07-22
-
Publication No.: US11715902B2Publication Date: 2023-08-01
- Inventor: Vinayakumar Shettar , John Marsh , Lawrence John Brekosky
- Applicant: TE Connectivity India Private Limited , Tyco Electronics UK Ltd , TE Connectivity Services GmbH
- Applicant Address: IN Bangalore
- Assignee: TE Connectivity India Private Limited,Tyco Electronics UK Ltd,TE Connectivity Services GmbH
- Current Assignee: TE Connectivity India Private Limited,Tyco Electronics UK Ltd,TE Connectivity Services GmbH
- Current Assignee Address: IN Bangalore; GB Swindon; CH Schaffhausen
- Main IPC: H01R12/58
- IPC: H01R12/58 ; H01R13/428 ; H01R13/11 ; H01R13/627 ; H01R13/629 ; H01R13/639

Abstract:
A low insertion force contact terminal which has a conductor mating portion, a securing portion and a substrate mating portion. The conductor mating portion is configured to terminate a conductor therein. The securing portion is configured to secure the terminal in a terminal receiving cavity of a housing. The substrate mating portion extends from the securing portion. The substrate mating portion has at least two sections which have curved portions thereon. The at least two sections move independently, which allows the curved portions to exert a normal force on walls of through holes of a substrate to which the contact terminal is mated which is sufficient to provide a stable electrical connection while allowing for a low insertion force.
Public/Granted literature
- US20220384980A1 LOW INSERTION FORCE CONTACT TERMINAL Public/Granted day:2022-12-01
Information query
IPC分类: