Invention Grant
- Patent Title: High speed, high density electrical connector with shielded signal paths
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Application No.: US17102133Application Date: 2020-11-23
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Publication No.: US11715914B2Publication Date: 2023-08-01
- Inventor: Marc B. Cartier, Jr. , John Robert Dunham , Mark W. Gailus , Donald A. Girard, Jr. , David Manter , Tom Pitten , Vysakh Sivarajan , Michael Joseph Snyder
- Applicant: Amphenol Corporation
- Applicant Address: US CT Wallingford
- Assignee: Amphenol Corporation
- Current Assignee: Amphenol Corporation
- Current Assignee Address: US CT Wallingford
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R13/6598 ; H01R12/72 ; H01R12/73 ; H01R13/518 ; H01R13/6587 ; H01R13/6585 ; H01R13/6599 ; H01R13/02 ; H01R43/24

Abstract:
A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
Public/Granted literature
- US20210175670A1 HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR WITH SHIELDED SIGNAL PATHS Public/Granted day:2021-06-10
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