Invention Grant
- Patent Title: Fan motor with heatsink and opposed guide for cooling airflow
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Application No.: US17046614Application Date: 2019-03-22
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Publication No.: US11715996B2Publication Date: 2023-08-01
- Inventor: Hidenori Kanda , Ko Nejigane
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Oliff PLC
- Priority: JP 18076856 2018.04.12
- International Application: PCT/JP2019/012172 2019.03.22
- International Announcement: WO2019/198466A 2019.10.17
- Date entered country: 2020-10-09
- Main IPC: H02K5/20
- IPC: H02K5/20 ; H02K9/06 ; H02K9/22 ; H02K11/33

Abstract:
A circuit board includes a board body disposed on the opposite side of a plate-shaped portion of a center piece to a stator, and a heat generating element mounted to a surface on the plate-shaped portion side of the board body and disposed inside a radial direction range of a rotor housing. A heat-dissipation portion of a heatsink is on the plate-shaped portion side of the circuit board such that the heat-dissipation portion contacts the heat generating element either directly or through a thermally conductive material. A guide that opposes the heat-dissipation portion in an axial direction of a motor unit is formed at the plate-shaped portion. The guide forms an airflow guiding path between itself and the heat-dissipation portion, the airflow guiding path being shaped so as to guide air taken in through an air intake port from the radial direction outside toward a center of the motor unit.
Public/Granted literature
- US20210104934A1 FAN MOTOR Public/Granted day:2021-04-08
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