Invention Grant
- Patent Title: Stacked power supply topologies and inductor devices
-
Application No.: US17307486Application Date: 2021-05-04
-
Publication No.: US11716026B2Publication Date: 2023-08-01
- Inventor: Kennith K. Leong , Matthias J. Kasper , Luca Peluso , Gerald Deboy
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Armis IP Law, LLC
- Main IPC: H05K3/32
- IPC: H05K3/32 ; H02M3/158 ; H01F27/24 ; H01F27/28 ; H01F41/02 ; H01F41/04 ; H02M7/00 ; H05K1/18 ; H02M3/335 ; H02M3/00

Abstract:
According to one configuration, an inductor device comprises: core material and one or more electrically conductive paths. The core material is magnetically permeable and surrounds (envelops) the one or more electrically conductive paths. Each of the electrically conductive paths extends through the core material of the inductor device from a first end of the inductor device to a second end of the inductor device. The magnetically permeable core material is operative to confine (guide, carry, convey, localize, etc.) respective magnetic flux generated from current flowing through a respective electrically conductive path. The core material stores the magnetic flux energy (i.e., first magnetic flux) generated from the current flowing through the first electrically conductive path. One configuration herein includes a power converter assembly comprising a stack of components including the inductor device as previously described as well as a first power interface, a second power interface, and one or more switches.
Public/Granted literature
- US20210257924A1 STACKED POWER SUPPLY TOPOLOGIES AND INDUCTOR DEVICES Public/Granted day:2021-08-19
Information query