Invention Grant
- Patent Title: Printed wiring board
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Application No.: US17708215Application Date: 2022-03-30
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Publication No.: US11716811B2Publication Date: 2023-08-01
- Inventor: Kenji Murase
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Gifu
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 21073810 2021.04.26
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A printed wiring board includes an insulating layer, and a conductor layer including a solid layer and wirings. The solid layer has an opening part. The wirings are formed in the opening part. The opening part includes first and second opening parts. The wirings include first and second wirings. The first wiring has a first land, a first portion, and a second portion. The second wiring has a second land, a third portion, and a fourth portion extending in parallel to the second portion. A first boundary between the first and second portions is in the second opening part. The first portion is bending at the first boundary and increasing distance between the first and second wirings. A second boundary between the third and fourth portions is in the second opening part. The third portion is bending at the second boundary and increasing distance between the first and second wirings.
Public/Granted literature
- US20220346231A1 PRINTED WIRING BOARD Public/Granted day:2022-10-27
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