Invention Grant
- Patent Title: LED chip insert, lighting device, lighting module, and method of manufacturing the lighting device
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Application No.: US17759348Application Date: 2021-01-20
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Publication No.: US11716815B2Publication Date: 2023-08-01
- Inventor: Michael Beck , Sebastian Jooss , Gerhard Behr
- Applicant: OSRAM GmbH
- Applicant Address: DE Munich
- Assignee: OSRAM GmbH
- Current Assignee: OSRAM GmbH
- Current Assignee Address: DE Munich
- Agency: Slater Matsil, LLP
- Priority: DE 2020200880.9 2020.01.24
- International Application: PCT/EP2021/051225 2021.01.20
- International Announcement: WO2021/148484A 2021.07.29
- Date entered country: 2022-07-22
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18

Abstract:
In an embodiment a LED chip insert for a printed circuit board includes a lead frame in which a number of electrically conductive strings with respective ends are formed by punching, the strings having support surfaces which are configured for mounting on the printed circuit board and which form a common plane, wherein the lead frame has a region formed as a recess with respect to the ends, an injection molded frame including an electrically insulating material and annularly surrounding a surface of the lead frame exposed within the region formed as the recess facing the ends of the strings, and thereby effecting an overall trough-like structure; and at least one LED chip which is placed in the region formed as the recess and has a first electrical contact terminal and a second electrical contact terminal, the first electrical contact terminal being electrically conductively connected to a first one of the strings and the second electrical contact terminal being electrically conductively connected to a second one of the strings.
Public/Granted literature
- US20230059982A1 LED Chip Insert, Lighting Device, Lighting Module, and Method of Manufacturing the Lighting Device Public/Granted day:2023-02-23
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