• Patent Title: LED chip insert, lighting device, lighting module, and method of manufacturing the lighting device
  • Application No.: US17759348
    Application Date: 2021-01-20
  • Publication No.: US11716815B2
    Publication Date: 2023-08-01
  • Inventor: Michael BeckSebastian JoossGerhard Behr
  • Applicant: OSRAM GmbH
  • Applicant Address: DE Munich
  • Assignee: OSRAM GmbH
  • Current Assignee: OSRAM GmbH
  • Current Assignee Address: DE Munich
  • Agency: Slater Matsil, LLP
  • Priority: DE 2020200880.9 2020.01.24
  • International Application: PCT/EP2021/051225 2021.01.20
  • International Announcement: WO2021/148484A 2021.07.29
  • Date entered country: 2022-07-22
  • Main IPC: H05K1/00
  • IPC: H05K1/00 H05K1/18
LED chip insert, lighting device, lighting module, and method of manufacturing the lighting device
Abstract:
In an embodiment a LED chip insert for a printed circuit board includes a lead frame in which a number of electrically conductive strings with respective ends are formed by punching, the strings having support surfaces which are configured for mounting on the printed circuit board and which form a common plane, wherein the lead frame has a region formed as a recess with respect to the ends, an injection molded frame including an electrically insulating material and annularly surrounding a surface of the lead frame exposed within the region formed as the recess facing the ends of the strings, and thereby effecting an overall trough-like structure; and at least one LED chip which is placed in the region formed as the recess and has a first electrical contact terminal and a second electrical contact terminal, the first electrical contact terminal being electrically conductively connected to a first one of the strings and the second electrical contact terminal being electrically conductively connected to a second one of the strings.
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