- Patent Title: Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device
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Application No.: US16402055Application Date: 2019-05-02
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Publication No.: US11716826B2Publication Date: 2023-08-01
- Inventor: Telesphor Kamgaing , Johanna M. Swan , Georgios Dogiamis , Henning Braunisch , Adel A. Elsherbini , Aleksandar Aleksov , Richard Dischler
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Akona IP PC
- Priority: GR 190100149 2019.03.29
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K1/02 ; H01P5/12 ; H01P3/16 ; H01L23/00 ; H01L25/18 ; H01L23/66 ; H01L23/538 ; H05K1/18
Abstract:
Embodiments may relate an electronic device that includes a first platform and a second platform coupled with a chassis. The platforms may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first platform and the second platform such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.
Public/Granted literature
- US20200315052A1 STACKED PLATFORMS WITH WAVEGUIDE INTERCONNECTS Public/Granted day:2020-10-01
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