An enclosure for providing liquid film cooling to heat generating components includes a chassis, a sump, a first pump, a plumbing system, tube plates, and a heat exchanger. The chassis includes cassettes that hold one or more heat generating components. The sump stores a liquid to be supplied to the heat generating components. The first pump draws the liquid from the sump and supplies the liquid to the tube plates through the plumbing system. Each tube plate is positioned between two cassettes to deliver the liquid to the heat generating components. The tube plates directly spray the liquid onto the heat generating components by way of nozzles embedded on the tube plates. The liquid is evaporated into vapors upon contact with the plurality of heat generating components. The heat exchanger condenses the vapors into condensed liquid upon contact. The condensed liquid is collected in the sump to be re-circulated.