A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package includes a substrate. The substrate includes a first recess including a first bottom surface on which a light emitter is mountable, and a first step surface having a first connection pad thereon, a second recess including a second bottom surface on which a light receiver is mountable, and a second step surface having a second connection pad thereon. In a direction connecting a center of the first bottom surface and a center of the second bottom surface in a plan view, the first step surface is located outward from the first bottom surface and the second step surface is located outward from the second bottom surface.