Invention Grant
- Patent Title: Thermally-conductive material layer and internal structure for ultrasound imaging
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Application No.: US17043692Application Date: 2019-03-22
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Publication No.: US11717271B2Publication Date: 2023-08-08
- Inventor: Junho Song , Edward Chan , Steven Michael Tavoletti , Mehdi Hejazi Dehaghani
- Applicant: KONINKLIJKE PHILIPS N.V.
- Applicant Address: NL Eindhoven
- Assignee: KONINKLIJKE PHILIPS N.V.
- Current Assignee: KONINKLIJKE PHILIPS N.V.
- Current Assignee Address: NL Eindhoven
- International Application: PCT/EP2019/057249 2019.03.22
- International Announcement: WO2019/185478A 2019.10.03
- Date entered country: 2020-09-30
- Main IPC: A61B8/00
- IPC: A61B8/00

Abstract:
An ultrasound imaging probe including a handle configured for handheld use; a support structure disposed within the handle and comprising a thermally-conductive material, the support structure further comprising a coupling surface and an external surface, the coupling surface disposed at a distal portion of the support structure; a continuous material layer coupled to the support structure, such that the continuous material layer is disposed on the coupling surface and the external surface, the continuous material layer thereby providing a heat transmission path between the coupling surface and the external surface; and an ultrasound sensor coupled to the support structure at the coupling surface and directly in contact with the continuous material layer at the coupling surface, such that heat from the ultrasound sensor is transmitted away to the support structure via the heat transmission path of the continuous material layer.
Public/Granted literature
- US20210059645A1 THERMALLY-CONDUCTIVE MATERIAL LAYER AND INTERNAL STRUCTURE FOR ULTRASOUND IMAGING Public/Granted day:2021-03-04
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