Invention Grant
- Patent Title: Spinal implant system and method
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Application No.: US17320441Application Date: 2021-05-14
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Publication No.: US11717422B2Publication Date: 2023-08-08
- Inventor: Hai H. Trieu
- Applicant: WARSAW ORTHOPEDIC INC.
- Applicant Address: US IN Warsaw
- Assignee: Warsaw Orthopedic Inc.
- Current Assignee: Warsaw Orthopedic Inc.
- Current Assignee Address: US IN Warsaw
- Agency: Sorell, Lenna & Schmidt, LLP
- The original application number of the division: US16538264 2019.08.12
- Main IPC: A61F2/44
- IPC: A61F2/44 ; A61F2/46 ; A61F2/30

Abstract:
A spinal implant system includes at least one interbody implant having a first member including a tissue engaging surface and at least one mating element. A second member includes a tissue engaging surface and at least one mating element. An intermediate member includes at least one mating element. An intra-operative surgical tool is connectable with at least one of the members to engage adjacent mating elements and fix the intermediate member with at least one of the first member and the second member. Implants, surgical instruments and methods are disclosed.
Public/Granted literature
- US20210267772A1 SPINAL IMPLANT SYSTEM AND METHOD Public/Granted day:2021-09-02
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