Invention Grant
- Patent Title: Automatic polishing system
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Application No.: US16486875Application Date: 2018-04-26
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Publication No.: US11717937B2Publication Date: 2023-08-08
- Inventor: Keiji Manabe , Hiroyuki Suzuki , Hideo Shiwa , Genji Nakayama
- Applicant: Taikisha Ltd.
- Applicant Address: JP Tokyo
- Assignee: Taikisha Ltd.
- Current Assignee: Taikisha Ltd.
- Current Assignee Address: JP Tokyo
- Agency: The Webb Law Firm
- Priority: JP 2017121582 2017.06.21
- International Application: PCT/JP2018/017030 2018.04.26
- International Announcement: WO2018/235430A 2018.12.27
- Date entered country: 2019-08-19
- Main IPC: B24B49/12
- IPC: B24B49/12 ; B25J5/02 ; B25J11/00 ; B25J13/08 ; B25J9/00

Abstract:
A three-dimensional shape measuring instrument is provided for measuring a three-dimensional shape of the polishing subject face. A polishing controller is provided for controlling a polishing robot alone or with a polishing tool, based on three-dimensional shape data of the polishing subject face obtained by the shape measurement by the three-dimensional shape measuring instrument. The polishing tool provides a polishing action on the respective part of the polishing subject face through controlling of the polishing robot alone or with the polishing tool by the polishing controller. By controlling a measuring robot and the three-dimensional shape measuring instrument by the polishing controller, the three-dimensional shape measuring instrument moves to a predetermined measuring position relative to the polishing subject face to measure the three-dimensional shape of the polishing subject face.
Public/Granted literature
- US20200009705A1 Automatic Polishing System Public/Granted day:2020-01-09
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