Invention Grant
- Patent Title: 3-D printing
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Application No.: US17561059Application Date: 2021-12-23
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Publication No.: US11718024B2Publication Date: 2023-08-08
- Inventor: Shannon Reuben Woodruff , Ali Emamjomeh , Yi Feng , Erica Fung , Carolin Fleischmann , Geoffrey Schmid
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dierker & Kavanaugh, P.C.
- The original application number of the division: US16077752
- Main IPC: B29C64/165
- IPC: B29C64/165 ; B33Y70/00 ; B33Y10/00 ; B29K67/00 ; B29K77/00

Abstract:
This disclosure relates to a material set including a build material for 3-D printing including particles of a polymer comprising polymer chains having at least one reactive group that is protected with a protecting group. The material set further includes an inkjet composition including a de-protecting agent for removal of the protecting group, and a liquid carrier.
Public/Granted literature
- US20220111587A1 3-D PRINTING Public/Granted day:2022-04-14
Information query