Invention Grant
- Patent Title: Mold lock remediation
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Application No.: US17474216Application Date: 2021-09-14
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Publication No.: US11718038B2Publication Date: 2023-08-08
- Inventor: Ricardo Chin , Blake Z. Reeves
- Applicant: Desktop Metal, Inc.
- Applicant Address: US MA Burlington
- Assignee: Desktop Metal, Inc.
- Current Assignee: Desktop Metal, Inc.
- Current Assignee Address: US MA Burlington
- Agency: Oak Law, PLLC
- Agent Jonathan D. Hall
- Main IPC: G05B19/4099
- IPC: G05B19/4099 ; B29C64/40 ; B29C64/386 ; B33Y50/02 ; B28B17/00 ; B28B1/00 ; H04N1/409 ; B33Y50/00 ; B22F10/20 ; B22F10/40 ; B22F10/64 ; B33Y10/00 ; B29C64/10

Abstract:
Mold lock is remediated by performing a layer-by-layer, two-dimensional analysis to identify unconstrained removal paths for any support structure or material within each two-dimensional layer, and then ensuring that aligned draw paths are present for all adjacent layers, all as more specifically described herein. Where locking conditions are identified, a sequence of modification rules are then applied, such as by breaking support structures into multiple, independently removable pieces. By addressing mold lock as a series of interrelated two-dimensional geometric problems, and reserving three-dimensional remediation strategies for more challenging, complex mold lock conditions, substantial advantages can accrue in terms of computational speed and efficiency.
Public/Granted literature
- US20210402473A1 MOLD LOCK REMEDIATION Public/Granted day:2021-12-30
Information query
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