Invention Grant
- Patent Title: Sheet processing device for adjusting projection of bonded portion, laminator, image forming apparatus, and image forming system
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Application No.: US17665864Application Date: 2022-02-07
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Publication No.: US11718081B2Publication Date: 2023-08-08
- Inventor: Wataru Takahashi , Tomohiro Furuhashi , Michitaka Suzuki , Tomomichi Hoshino , Fumiharu Yoneyama , Kazuyoshi Matsuo , Makoto Hidaka , Koki Sakano , Akira Kunieda , Takahiro Watanabe , Takuya Morinaga , Yohsuke Haraguchi
- Applicant: Wataru Takahashi , Tomohiro Furuhashi , Michitaka Suzuki , Tomomichi Hoshino , Fumiharu Yoneyama , Kazuyoshi Matsuo , Makoto Hidaka , Koki Sakano , Akira Kunieda , Takahiro Watanabe , Takuya Morinaga , Yohsuke Haraguchi
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce L.L.C.
- Priority: JP 19083905 2019.04.25
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B32B37/14 ; B65H3/66 ; B32B37/18 ; B65H3/06

Abstract:
A sheet separation device includes a rotator, a nipping member to nip the two-ply sheet with the rotator, a first conveyor to convey the two-ply sheet in a first direction toward the rotator and a second direction reverse thereto, a winding member to wind the two-ply sheet around the rotator, a second conveyor to convey a sheet medium in the second direction, a separation claw to move in a width direction; a sheet guide to guide the separated two sheets to different passages; and control circuitry. The first conveyor conveys the two-ply sheet to the rotator with a bonded portion at an upstream end. The control circuitry inserts the separation claw into a space between the two sheets, adjusts a projection amount of the two-ply sheet from a nip of the first conveyor in the second direction, and inserts the sheet medium in two-ply sheet adjusted in the projection amount.
Public/Granted literature
- US20220153008A1 SHEET SEPARATION DEVICE, LAMINATOR, IMAGE FORMING APPARATUS, AND IMAGE FORMING SYSTEM Public/Granted day:2022-05-19
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