Invention Grant
- Patent Title: Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board
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Application No.: US17845200Application Date: 2022-06-21
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Publication No.: US11718708B2Publication Date: 2023-08-08
- Inventor: Katsuya Tomizawa , Mayumi Kikuchi , Hidetoshi Kawai
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP 18140494 2018.07.26
- Main IPC: B32B7/02
- IPC: B32B7/02 ; C08G59/62 ; B32B5/26 ; C08J5/24 ; B32B5/02 ; C08G59/30 ; C08K3/36 ; C08K5/315 ; C08K5/3415 ; C08L63/00 ; H05K1/03
Abstract:
A curable composition is provided that includes an alkenyl phenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and a thermosetting resin E, in which the thermosetting resin E contains one or more selected from the group consisting of a maleimide compound, a cyanate ester compound, a phenolic compound, an alkenyl-substituted nadimide compound, and an epoxy compound.
Public/Granted literature
- US20220325034A1 CURABLE COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE AND PRINTED WIRING BOARD Public/Granted day:2022-10-13
Information query
