Invention Grant
- Patent Title: Chemical mechanical planarization composition for polishing oxide materials and method of use thereof
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Application No.: US16533381Application Date: 2019-08-06
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Publication No.: US11718767B2Publication Date: 2023-08-08
- Inventor: Ming-Shih Tsai , Chia-Chien Lee , Rung-Je Yang , Anu Mallikarjunan , Chris Keh-Yeuan Li , Hongjun Zhou , Joseph D. Rose , Xiaobo Shi
- Applicant: Versum Materials US, LLC
- Applicant Address: US AZ Tempe
- Assignee: Versum Materials US, LLC
- Current Assignee: Versum Materials US, LLC
- Current Assignee Address: US AZ Tempe
- Agent Lina Yang
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09K13/00 ; H01L21/3105 ; H01L21/321 ; H01L21/306 ; C09K3/14 ; B24B37/04 ; B24B1/00 ; C09G1/06 ; C09G1/04 ; C09G1/00 ; C09K13/04
Abstract:
Polishing compositions comprising ceria coated silica particles and organic acids having one selected from the group consisting of sulfonic acid group, phosphonic acid group, pyridine compound, and combinations thereof, with pH between 5 and 10 and electrical conductivity between 0.2 and 10 millisiemens per centimeter provide very high silicon oxide removal rates for advanced semiconductor device manufacturing.
Public/Granted literature
- US20200048551A1 Chemical Mechanical Planarization Composition For Polishing Oxide Materials And Method Of Use Thereof Public/Granted day:2020-02-13
Information query
