Invention Grant
- Patent Title: Curable resin composition and curable sheet
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Application No.: US17293327Application Date: 2019-07-12
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Publication No.: US11718770B2Publication Date: 2023-08-08
- Inventor: Takayuki Hashimoto , Eiichi Nomura , Katsushi Kan , Daisuke Mori , Yosuke Oi , Yukio Yada , Takashi Hiraoka , Takeyuki Kitagawa
- Applicant: NAGASE CHEMTEX CORPORATION
- Applicant Address: JP Osaka
- Assignee: NAGASE CHEMTEX CORPORATION
- Current Assignee: NAGASE CHEMTEX CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP 18214221 2018.11.14
- International Application: PCT/JP2019/027716 2019.07.12
- International Announcement: WO2020/100345A 2020.05.22
- Date entered country: 2021-05-12
- Main IPC: B32B7/12
- IPC: B32B7/12 ; C09J7/35 ; C09J7/10 ; B32B9/00 ; B32B9/04 ; B32B27/20 ; B32B27/28 ; B32B27/30 ; B32B27/36 ; B32B27/38 ; C09J11/04 ; H01L23/29
Abstract:
A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.
Public/Granted literature
- US20210403765A1 CURABLE RESIN COMPOSITION AND CURABLE SHEET Public/Granted day:2021-12-30
Information query
