Invention Grant
- Patent Title: Electroless Co—W plating film
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Application No.: US17750660Application Date: 2022-05-23
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Publication No.: US11718916B2Publication Date: 2023-08-08
- Inventor: Shoji Iguchi , Akio Itamura , Shoichi Fukui , Yukinori Oda , Masaaki Sato , Yoshihito Il , Hiroki Okubo
- Applicant: C. Uyemura & Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: C. UYEMURA & CO., LTD.
- Current Assignee: C. UYEMURA & CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 21089256 2021.05.27 JP 22014117 2022.02.01 JP 22070732 2022.04.22
- Main IPC: C23C18/32
- IPC: C23C18/32 ; C23C18/00 ; C23C30/00 ; C22C19/00 ; C22C19/07 ; B32B15/04 ; C23C18/36 ; C23C18/34 ; C23C18/54 ; C23C18/50 ; C23C18/48 ; C23C18/18
Abstract:
An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 μm or more.
Public/Granted literature
- US20220389587A1 ELECTROLESS Co-W PLATING FILM AND ELECTROLESS Co-W PLATING SOLUTION Public/Granted day:2022-12-08
Information query
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