Invention Grant
- Patent Title: Material processing utilizing high-frequency beam shaping
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Application No.: US16831986Application Date: 2020-03-27
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Publication No.: US11719897B2Publication Date: 2023-08-08
- Inventor: Mark Mordarski , Bryan Lochman , Francisco Villarreal-Saucedo
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: B23K26/0622
- IPC: B23K26/0622 ; G02B6/42 ; B23K26/06 ; B23K26/073 ; B23K26/064
Abstract:
In various embodiments, laser emissions are steered into different regions of an optical fiber, and/or into different optical fibers, in a temporal pattern such that an output has different spatial output profiles. The temporal pattern has a frequency sufficient such that a workpiece is processed by an effective output shape combining the different spatial output profiles.
Public/Granted literature
- US20200310055A1 MATERIAL PROCESSING UTILIZING HIGH-FREQUENCY BEAM SHAPING Public/Granted day:2020-10-01
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