Invention Grant
- Patent Title: Resist underlayer film-forming composition containing indolocarbazole novolak resin
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Application No.: US17880761Application Date: 2022-08-04
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Publication No.: US11720024B2Publication Date: 2023-08-08
- Inventor: Hikaru Tokunaga , Daigo Saito , Keisuke Hashimoto , Rikimaru Sakamoto
- Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
- Current Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 15235002 2015.12.01
- The original application number of the division: US15780657
- Main IPC: G03F7/11
- IPC: G03F7/11 ; G03F7/40 ; G03F7/20 ; C08G12/26 ; C08G16/02 ; C09D161/26 ; H01L21/027

Abstract:
A resist underlayer film for lithography does not cause intermixing with a resist layer, has high dry etching resistance and high heat resistance, and generates a low amount of sublimate. A resist underlayer film-forming composition containing a polymer having a unit structure of the following formula (1):
wherein A is a divalent group having at least two amino groups, the group is derived from a compound having a condensed ring structure and an aromatic group for substituting a hydrogen atom on the condensed ring, and B1 and B2 are each independently a hydrogen atom, an alkyl group, a benzene ring group, a condensed ring group, or a combination thereof, or B1 and B2 optionally form a ring with a carbon atom bonded to B1 and B2.
wherein A is a divalent group having at least two amino groups, the group is derived from a compound having a condensed ring structure and an aromatic group for substituting a hydrogen atom on the condensed ring, and B1 and B2 are each independently a hydrogen atom, an alkyl group, a benzene ring group, a condensed ring group, or a combination thereof, or B1 and B2 optionally form a ring with a carbon atom bonded to B1 and B2.
Public/Granted literature
- US20220404707A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING INDOLOCARBAZOLE NOVOLAK RESIN Public/Granted day:2022-12-22
Information query
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