A semiconductor device includes a first chip, a plurality of second chips, and a plurality of first signal lines. The first chip is electrically connected to a terminal group that receives a first signal from a host. The second chips are electrically connected to the first chip and are capable of outputting respective ready/busy signals. The ready/busy signals can be transferred through the first signal lines. Each of the second chips is respectively connected to the first chip through a corresponding first signal line among the plurality of first signal lines.