Invention Grant
- Patent Title: Semiconductor layout in FinFET technologies
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Application No.: US16920524Application Date: 2020-07-03
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Publication No.: US11720734B2Publication Date: 2023-08-08
- Inventor: Farzan Farbiz , Thomas Hoffmann , Xin Yi Zhang
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kowert Hood Munyon Rankin and Goetzel PC
- Agent Rory D. Rankin
- Main IPC: G06F30/392
- IPC: G06F30/392 ; H01L27/118 ; H01L27/092 ; H01L29/78 ; G06F30/33 ; G06F30/39 ; G06F30/394 ; H01L27/02

Abstract:
Systems, apparatuses, and methods for placing cells in an integrated circuit are described. In various embodiments, an integrated circuit is divided into many partitions. In a first set of partitions susceptible to transistor latch-up, the many transistor gate stripes are connected to one of the power rails rather than left floating. The lengths of the transistor gate stripes are shortened for well tap cells in the first partition, but increased in a second partition susceptible for poor signal integrity. One or more implant layers are formed underneath the transistor gate stripes in each of the first and second partitions to adjust an amount of protection against transistor latch-up and poor signal integrity. An electrostatic discharge transistor is included with at least one source region of multiple source regions formed in a well with a same doping polarity as the at least one source region.
Information query