Invention Grant
- Patent Title: Semiconductor structure, device, and method
-
Application No.: US17227780Application Date: 2021-04-12
-
Publication No.: US11720737B2Publication Date: 2023-08-08
- Inventor: Shih-Wei Peng , Jiann-Tyng Tzeng , Wei-Cheng Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: G06F7/50
- IPC: G06F7/50 ; G06F30/398 ; G03F1/70 ; G03F1/36 ; G09G3/3208 ; H10K59/131 ; H10K59/35 ; H01L27/12 ; H01L27/118

Abstract:
A structure includes a first transistor of a first type, the first transistor including a first channel, a first conductive segment, and a second conductive segment, a second transistor of a second type, the second transistor including a second channel, a third conductive segment, and a fourth conductive segment, and a gate. The first channel extends through the gate between the first and second conductive segments, the second channel extends through the gate between the third and fourth conductive segments and is aligned with the first channel at a center of the first transistor, the first and third conductive segments extend away from the center of the first transistor in opposite directions, and the second and fourth conductive segments extend away from the center of the first transistor in opposite directions.
Public/Granted literature
- US20210233990A1 SEMICONDUCTOR STRUCTURE, DEVICE, AND METHOD Public/Granted day:2021-07-29
Information query