Invention Grant
- Patent Title: Coil component
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Application No.: US16550877Application Date: 2019-08-26
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Publication No.: US11721473B2Publication Date: 2023-08-08
- Inventor: Joung Gul Ryu , Ji Man Ryu , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20180122107 2018.10.12
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/32 ; H01F27/29

Abstract:
A coil component includes a body, an insulating substrate embedded in the body and including an insulating resin, and first and second substrate protection layers covering respective surfaces of the insulating substrate to protect the insulating substrate and including a ceramic. A coil portion includes first and second coil patterns respectively disposed on the first and second substrate protection layers. Each of the first and second coil patterns includes a first conductive layer, disposed on the respective first or second substrate protection layer, and a second conductive layer disposed on the first conductive layer to expose a side surface of the first conductive layer.
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