Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US17506072Application Date: 2021-10-20
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Publication No.: US11721491B2Publication Date: 2023-08-08
- Inventor: Jun Il Song , Sang Won Choi , Seung Heui Lee , Su Min Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20200183841 2020.12.24
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/008 ; H01G4/12 ; H01G4/012

Abstract:
A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers; and external electrodes disposed on the body. One of the internal electrodes includes interfacial portions disposed at interfaces thereof with two of the dielectric layers, between which the one of the internal electrodes is disposed, and a central portion disposed between the interfacial portions, and one of the interfacial portions has a Mn content higher than an average Mn content of the central portion and an average Mn content of one of the dielectric layers which is in contact with the one of the interfacial portions.
Public/Granted literature
- US20220208471A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2022-06-30
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